{"product_id":"vis-business-model-canvas","title":"VIS Business Model Canvas","description":"\u003cdiv class=\"pr-shrt-dscr-wrapper orange\"\u003e\n\u003csection class=\"pr-shrt-dscr-box\"\u003e\n\u003cdiv class=\"pr-shrt-dscr-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/GENERAL-Magnifier-Icon.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eUnlock a concise Business Model Canvas preview that maps value, customers, and revenue\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"pr-shrt-dscr-content\"\u003e\n\u003cp\u003eUnlock VIS’s strategic playbook with our concise Business Model Canvas preview—designed to show how value, customers, and revenue interlock to drive growth. Dive into the full Canvas for a complete, section-by-section breakdown with actionable insights and financial implications. Purchase the downloadable Word and Excel files to benchmark, adapt, and scale your strategy today.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"container_new_design\"\u003e\n\u003cdiv class=\"text-section text-1_new_design\"\u003e\n\u003cdiv class=\"frst_big_letter_heading\"\u003e\n\u003ch2\u003e\n\u003cspan class=\"frst_big_letter_letter green\"\u003eP\u003c\/span\u003e\u003cspan class=\"frst_big_letter_text\"\u003eartnerships\u003c\/span\u003e\n\u003c\/h2\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"sub-highlight-wrapper green\"\u003e\n\u003csection class=\"sub-highlight-box\"\u003e\n\u003cdiv class=\"sub-highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eWafer equipment and materials suppliers\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"sub-highlight-content\"\u003e\n\u003cp\u003eStrategic ties with lithography, etch, deposition and test vendors secure leading toolsets and fast spares; ASML remains the sole supplier of EUV systems in 2024. Long-term contracts with top wafer suppliers Shin‑Etsu and SUMCO and specialty gas\/photoresist vendors stabilize input quality and pricing. Co-development tailors tools for HV, mixed‑signal and analog nodes, while joint roadmaps with suppliers shorten cycle times and improve yield.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003csection class=\"sub-highlight-box\"\u003e\n\u003cdiv class=\"sub-highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eIP licensors and EDA ecosystem\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"sub-highlight-content\"\u003e\n\u003cp\u003eAlliances with IP vendors for analog, memory macros and interface blocks accelerate customer tape-outs and reuse proven building blocks; partnerships with EDA firms (Big Three held \u0026gt;80% share in 2023–24) secure robust PDKs, POC flows and design enablement for VIS processes. Reference flows and verification kits cut re-spins, and joint support centers can shorten design-to-silicon timelines materially, improving time-to-market.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"image-section image-1_new_design\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Image.svg\" alt=\"Explore a Preview\"\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003csection class=\"highlight-box\"\u003e\n\u003cdiv class=\"highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eOSAT and packaging partners\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"highlight-content\"\u003e\n\u003cp\u003eCollaboration with OSAT and advanced packaging houses delivers turnkey assembly, test and packaging services and in 2024 co-qualification covered five package families: QFN, QFP, BGA, WLCSP and power packages aligned to HV and discrete lines. Shared reliability data and joint test-program development increased final yield by 4–6 percentage points in 2024. Logistics integration shortened cycle times by about 15% and boosted on-time delivery to roughly 98% in 2024.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003cdiv class=\"product-green-section\"\u003e\n\u003cdiv class=\"product-box-green-section4\"\u003e\n\u003cdiv class=\"title-row-green-section\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Icon-Color-2.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eKey customers as strategic collaborators\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"content-row-green-section blur_box\"\u003e\n\u003cp\u003eAnchor customers in communications, consumer and computing co-invest in process tweaks and capacity reservations, with 2024 early-access pilots funding tooling and layout changes to speed node readiness. Early-access programs steer VIS node evolution through iterative feedback loops and defined KPIs. Joint yield-ramp teams shorten NPI stabilization cycles, and multi-year agreements enable predictable loading and capex planning.\u003c\/p\u003e\n\u003cp\u003e\u003c\/p\u003e\n\u003cul class=\"lst_crct\"\u003e\n\u003cli\u003eAnchor accounts co-invest in pilots and capacity reservations\u003c\/li\u003e\n\u003cli\u003e2024 early-access programs guide node roadmaps\u003c\/li\u003e\n\u003cli\u003eJoint yield-ramp teams accelerate NPI stability\u003c\/li\u003e\n\u003cli\u003eMulti-year agreements underpin predictable loading and capex\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cbutton class=\"get_full_prdct_orange\" onclick=\"get_full()\"\u003e\u003c\/button\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"product-box-green-section4\"\u003e\n\u003cdiv class=\"title-row-green-section\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Icon-Color-2.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eAcademia and R\u0026amp;D institutes\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"content-row-green-section blur_box\"\u003e\n\u003cp\u003eResearch ties with universities and R\u0026amp;D institutes support device modeling, reliability, and novel materials, with US academic R\u0026amp;D funding remaining above $90 billion in 2024, enabling large-scale sponsored projects targeting HV reliability, analog precision, and embedded memory. Sponsored collaborations commonly fund multi-year projects that shorten time-to-prototype and leverage shared labs to de-risk exploratory technologies while building a robust talent pipeline. Talent pipelines deliver 30–50% of new engineering hires in VIS-focused firms, reinforcing depth in device physics and circuit design.\u003c\/p\u003e\n\u003cp\u003e\u003c\/p\u003e\n\u003cul class=\"lst_crct\"\u003e\n\u003cli\u003eResearch focus: device modeling, reliability, new materials\u003c\/li\u003e\n\u003cli\u003eSponsored projects: HV reliability, analog precision, embedded memory\u003c\/li\u003e\n\u003cli\u003eShared labs: lower prototype cost and technical risk\u003c\/li\u003e\n\u003cli\u003eTalent pipeline: significant source of engineering hires\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cbutton class=\"get_full_prdct_orange\" onclick=\"get_full()\"\u003e\u003c\/button\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003csection class=\"highlight-box\"\u003e\n\u003cdiv class=\"highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Partnerships-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eSupplier, EDA and OSAT alliances boost yield +4–6 pts, cut cycle ≈15%, 98% OT\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"highlight-content\"\u003e\n\u003cp\u003eStrategic supplier and IP\/EDA alliances (ASML sole EUV 2024; Big Three EDA \u0026gt;80% 2023–24) secure tools, PDKs and co-development, stabilizing inputs via Shin‑Etsu\/SUMCO. OSAT\/pack partners co-qualify five package families, lifting final yield +4–6 pts and cutting cycle time ≈15% (on-time delivery ~98% in 2024). University and anchor-customer collaborations fund pilots, supplying 30–50% of new hires and leveraging \u0026gt;$90B US academic R\u0026amp;D in 2024.\u003c\/p\u003e\n\u003ctable class=\"tbl_prdct green_head blur_tbl\"\u003e\n\u003cthead\u003e\u003ctr\u003e\n\u003cth\u003ePartner\u003c\/th\u003e\n\u003cth\u003e2024 metric\u003c\/th\u003e\n\u003cth\u003eImpact\u003c\/th\u003e\n\u003c\/tr\u003e\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eASML\u003c\/td\u003e\n\u003ctd\u003esole EUV supplier\u003c\/td\u003e\n\u003ctd\u003enode enablement\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eBig Three EDA\u003c\/td\u003e\n\u003ctd\u003e\u0026gt;80% share\u003c\/td\u003e\n\u003ctd\u003ePDKs \u0026amp; flows\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOSAT\u003c\/td\u003e\n\u003ctd\u003e5 packages co-qualified\u003c\/td\u003e\n\u003ctd\u003e+4–6% yield, 98% OT\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eAcademia\u003c\/td\u003e\n\u003ctd\u003e\u0026gt;$90B US R\u0026amp;D\u003c\/td\u003e\n\u003ctd\u003e30–50% hires, sponsored R\u0026amp;D\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cbutton class=\"get_full_prdct_orange\" onclick=\"get_full()\"\u003e\u003c\/button\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003cdiv class=\"product-includes\"\u003e\n\u003ch2\u003eWhat is included in the product\u003c\/h2\u003e\n\u003cdiv class=\"product-box-includes\"\u003e\n\u003cdiv class=\"title-row-includes\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/GENERAL-Word-Icon.svg\" alt=\"Word Icon\"\u003e\n\u003cstrong\u003eDetailed Word Document\u003c\/strong\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"content-row-includes\"\u003e\n\u003cp\u003eA concise, pre-written VIS Business Model Canvas mapping nine classic BMC blocks to the company’s strategy, value propositions, channels and customer segments with narrative and competitive insights. Ideal for presentations, funding discussions and data-driven validation of business ideas.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"plus-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/GENERAL-Plus-Icon.svg\" alt=\"Plus Icon\"\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"product-box-includes\"\u003e\n\u003cdiv class=\"title-row-includes\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/GENERAL-Excel-Icon.svg\" alt=\"Excel Icon\"\u003e\n\u003cstrong\u003eCustomizable Excel Spreadsheet\u003c\/strong\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"content-row-includes\"\u003e\n\u003cp\u003eHigh-level view of the VIS Business Model Canvas with editable cells that relieves the pain of scattered strategy notes and unclear responsibilities. Saves hours of formatting by delivering a clean, shareable one-page snapshot ideal for fast decision-making and collaborative iteration.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"container_new_design\"\u003e\n\u003cdiv class=\"text-section text-2_new_design\"\u003e\n\u003cdiv class=\"frst_big_letter_heading\"\u003e\n\u003ch2\u003e\n\u003cspan class=\"frst_big_letter_letter orange\"\u003eA\u003c\/span\u003e\u003cspan class=\"frst_big_letter_text\"\u003ectivities\u003c\/span\u003e\n\u003c\/h2\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"sub-highlight-wrapper orange\"\u003e\n\u003csection class=\"sub-highlight-box\"\u003e\n\u003cdiv class=\"sub-highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eSpecialty process development\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"sub-highlight-content\"\u003e\n\u003cp\u003eContinuous refinement of HV, mixed-signal, analog, discrete and specialty memory nodes, driven by device modeling and quarterly PDK updates, expands SPICE corner coverage to industry-standard 27 corners. Reliability qualification follows AEC-Q100 and ISO 26262 (up to ASIL D) for automotive, industrial and consumer. DOE cycles (typically 3–5 factor designs) iterate to enhance performance and reduce cost.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003csection class=\"sub-highlight-box\"\u003e\n\u003cdiv class=\"sub-highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eHigh-yield wafer fabrication\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"sub-highlight-content\"\u003e\n\u003cp\u003eOperate fabs with strict SPC, APC and full traceability, achieving wafer-level yields of 88-96% in advanced-node 2024 benchmarks. Inline metrology and feedback control cut parametric variation ~30% and tighten CD sigma to ~2–3 nm. Defect reduction and recipe optimization pushed defect density \u0026lt;0.1\/cm2 and raised throughput 10–18%, enabling capacity balancing to meet customer lead times of 6–12 weeks.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"image-section image-2_new_design\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Image.svg\" alt=\"Explore a Preview\"\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003csection class=\"highlight-box\"\u003e\n\u003cdiv class=\"highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eDesign enablement and tape-out support\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"highlight-content\"\u003e\n\u003cp\u003eProvide validated PDKs, DRC\/LVS decks and analog-focused reference flows and run detailed design reviews and mask-data prep to compress time-to-silicon to 12–20 weeks. Offer MPW\/shuttle prototyping (reducing NRE by ~60–80% versus full-flow runs) and coordinate seamlessly with foundries (TSMC, Samsung, GlobalFoundries) and EDA\/IP partners (Cadence, Synopsys, Arm) for handoff and IP integration.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003cdiv class=\"product-orange-section\"\u003e\n\u003cdiv class=\"product-box-orange-section4\"\u003e\n\u003cdiv class=\"title-row-orange-section\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Icon-Color-2.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eQuality, reliability, and compliance\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"content-row-orange-section blur_box\"\u003e\n\u003cp\u003eExecute qualification plans (HTOL, HAST, ESD\/LU) aligned to ISO 9001 and IATF 16949 requirements, with formal test protocols and traceable records. Maintain applicable certifications and participate in customer audits, driving scorecard targets through measurable KPIs. Use 8D root-cause analysis and closed-loop corrective actions to reduce recurrence and improve reliability.\u003c\/p\u003e\n\u003cp\u003e\u003c\/p\u003e\n\u003cul class=\"lst_crct\"\u003e\n\u003cli\u003eHTOL\/HAST\/ESD\/LU test execution\u003c\/li\u003e\n\u003cli\u003eISO 9001 \/ IATF 16949 maintenance\u003c\/li\u003e\n\u003cli\u003e8D root-cause \u0026amp; corrective actions\u003c\/li\u003e\n\u003cli\u003eCustomer audits \u0026amp; scorecard management\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cbutton class=\"get_full_prdct_green\" onclick=\"get_full()\"\u003e\u003c\/button\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"product-box-orange-section4\"\u003e\n\u003cdiv class=\"title-row-orange-section\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Icon-Color-2.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003eSupply chain and customer program management\u003c\/h3\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"content-row-orange-section blur_box\"\u003e\n\u003cp\u003eSupply chain and customer program management drives forecasting, material planning, and die bank strategies to hit 2024 targets: 95% on-time in-full and cycle times under 8 weeks, with die banks sized for 8–12 week buffers; NPI ramps are managed to reach volume in 12–16 weeks while phase-in\/phase-out controls limit disruptions. Cost and yield reporting is updated weekly with action plans reducing scrap\/yield loss by targeted 10% year-over-year.\u003c\/p\u003e\n\u003cp\u003e\u003c\/p\u003e\n\u003cul class=\"lst_crct\"\u003e\n\u003cli\u003eForecasting: rolling 12-week accuracy goal 95%\u003c\/li\u003e\n\u003cli\u003eMaterial planning: 8–12 week buffer\u003c\/li\u003e\n\u003cli\u003eCycle time: \u0026lt;8 weeks target\u003c\/li\u003e\n\u003cli\u003eNPI ramp: 12–16 weeks to volume\u003c\/li\u003e\n\u003cli\u003eCost\/yield: weekly reports, −10% Y\/Y scrap\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/div\u003e\n\u003cbutton class=\"get_full_prdct_green\" onclick=\"get_full()\"\u003e\u003c\/button\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e\n\u003csection class=\"highlight-box\"\u003e\n\u003cdiv class=\"highlight-icon\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/CANVAS-Content-Activities-Icon-Color-1.svg\" alt=\"Icon\"\u003e\n\u003ch3\u003e\u003c\/h3\u003e\n\u003cp\u003eRefine HV\/mixed-signal nodes: 12–20 wks to silicon, \u003cstrong\u003e95%\u003c\/strong\u003e OTIF\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"highlight-content\"\u003e\n\u003cp\u003eRefine HV\/mixed-signal\/analog nodes with quarterly PDKs (27 SPICE corners) and DOE cycles (3–5 factors) to meet AEC-Q100\/ISO 26262 ASIL D. Operate fabs with SPC\/APC achieving 2024 wafer yields 88–96%, CD sigma 2–3 nm, defect density \u0026lt;0.1\/cm2. Provide PDKs\/MPW, compress time-to-silicon to 12–20 weeks and maintain OTIF 95% with cycle times \u0026lt;8 weeks.\u003c\/p\u003e\n\u003ctable class=\"tbl_prdct green_head blur_tbl\"\u003e\n\u003cthead\u003e\u003ctr\u003e\n\u003cth\u003eMetric\u003c\/th\u003e\n\u003cth\u003e2024\u003c\/th\u003e\n\u003c\/tr\u003e\u003c\/thead\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd\u003eWafer yield\u003c\/td\u003e\n\u003ctd\u003e88–96%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eCD sigma\u003c\/td\u003e\n\u003ctd\u003e2–3 nm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eDefect density\u003c\/td\u003e\n\u003ctd\u003e\u0026lt;0.1\/cm2\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eTime-to-silicon\u003c\/td\u003e\n\u003ctd\u003e12–20 wks\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd\u003eOTIF\u003c\/td\u003e\n\u003ctd\u003e95%\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003cbutton class=\"get_full_prdct_green\" onclick=\"get_full()\"\u003e\u003c\/button\u003e\n\u003c\/div\u003e\n\u003c\/section\u003e\n\u003cdiv class=\"container_new_design\"\u003e\n\u003cdiv class=\"text-section text-1_new_design\"\u003e\n\u003ch2\u003e\n\u003cspan style=\"color: #3BB77E;\"\u003eFull Document Unlocks After Purchase\u003c\/span\u003e\u003cbr\u003e Business Model Canvas\u003c\/h2\u003e\n\u003cp\u003eThe VIS Business Model Canvas you see here is a live preview of the exact document you'll receive—no mockup or sample. After purchase you'll download the full, editable file formatted just as shown. It's ready to edit, present, and apply immediately.\u003c\/p\u003e\n\u003c\/div\u003e\n\u003cdiv class=\"image-section image-1_new_design\"\u003e\n\u003cimg src=\"\/cdn\/shop\/files\/GENERAL-Explore-Preview.svg\" alt=\"Explore a Preview\"\u003e\n\u003c\/div\u003e\n\u003c\/div\u003e","brand":"PortersFiveForce","offers":[{"title":"Default Title","offer_id":56162256126329,"sku":"vis-business-model-canvas","price":10.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0914\/5276\/8633\/files\/vis-business-model-canvas.png?v=1762697908","url":"https:\/\/portersfiveforce.com\/products\/vis-business-model-canvas","provider":"Porter's Five Forces","version":"1.0","type":"link"}